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Harper, J. M. E.; Cabral, C.; Andricacos, P. C.; Gignac, L.; Noyan, I. C.; Rodbell, K. P.; Hu, C. K. . (1999). Mechanisms for Microstructure Evolution in Electroplated Copper Thin Films. MRS Proceedings, 564(), 387–. doi:10.1557/proc-564-387 

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