Influences of reaction products on etch rates and linewidths in a poly-Si/oxide etching process using HBr/O[sub 2] based inductively coupled plasma

K. Miwa; T. Mukai. (2002). Influences of reaction products on etch rates and linewidths in a poly-Si/oxide etching process using HBr/O[sub 2] based inductively coupled plasma. , (), –. doi:10.1116/1.1511216

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