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Christophe Maleville; B. Aspar; T. Poumeyrol; H. Moriceau; M. Bruel; A.J. Auberton-Hervè; T. Barge. (1997). Wafer bonding and H-implantation mechanisms involved in the Smart-cut® technology. , 46(1-3), 14–19. doi:10.1016/s0921-5107(96)01923-x 

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